Technology
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USTR says no immediate chip tariffs coming: Report
Washington, May 23 (IANS) US Trade Representative Jamieson Greer said that there were no immediate semiconductor tariffs coming, according to…
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Maharashtra emerges data centre capital with Rs 16.69 lakh crore investment pipeline
Mumbai, May 23 (IANS) In a major boost to India’s digital infrastructure, Maharashtra has firmly positioned itself as the premier…
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Adani Group helping Maharashtra achieve holistic economic growth: Industry leaders
Mumbai, May 22 (IANS) From the Navi Mumbai International Airport to the redevelopment of Dharavi, the Adani Group is making…
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India’s data centres expected to create 1 lakh jobs for engineers: Jitendra Singh
New Delhi, May 22 (IANS) Union Minister of State (Independent Charge) for Science & Technology, Dr Jitendra Singh, said on…
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India offers unique combination of technology, talent, growth opportunities through GIFT City: FM Sitharaman
Gandhinagar, May 22 (IANS) Union Finance Minister Nirmala Sitharaman on Friday said India offers a unique blend of scale, technology,…
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HMT’s machine tool export to South Africa reflects global trust in Indian engineering: Minister
New Delhi, May 22 (IANS) Union Minister for Heavy Industries and Steel H. D. Kumaraswamy on Friday said the export…
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India’s UPI network expands to Cyprus, services to begin next year
New Delhi, May 22 (IANS) India’s Unified Payments Interface (UPI) will become operational in Cyprus from next year, marking another…
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Up to 120 new Indian startups could be listed by 2030: Report
New Delhi, May 22 (IANS) India’s start‑up ecosystem has entered a phase of “cautious growth” with an active initial public…
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Piyush Goyal, Sonowal hold meet to facilitate foreign trade
New Delhi, May 22 (IANS) Commerce and Industry Minister Piyush Goyal on Friday co-chaired a meeting with Minister of Ports,…
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NHAI collaborates with Norwegian Institute for consultation in tunnel engineering
New Delhi, May 22 (IANS) The National Highway Authority of India (NHAI) signed a memorandum of understanding (MoU) with the…
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